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Dow Unveils DOW Cooling Science at COMPUTEX TAIPEI 2026 for AI Thermal Management
INSIDE 硬塞 AI3h agoHardware
Dow presented its DOW™ Cooling Science platform at COMPUTEX TAIPEI 2026, highlighting high-performance silicone-based solutions. The platform targets thermal management challenges in AI data centers and advanced semiconductors as computing density rises. The announcement positions materials science as part of the broader AI infrastructure ecosystem, alongside industry collaboration under the “AI Together” theme.