Dow Unveils DOW Cooling Science at COMPUTEX TAIPEI 2026 for AI Thermal Management

Original: 陶氏公司亮相 COMPUTEX TAIPEI 2026，以創新熱管理材料科學助力實現「AI Together」

Dow introduced DOW Cooling Science to address AI data center and advanced semiconductor cooling challenges.

Dow presented its DOW™ Cooling Science platform at COMPUTEX TAIPEI 2026, highlighting high-performance silicone-based solutions. The platform targets thermal management challenges in AI data centers and advanced semiconductors as computing density rises. The announcement positions materials science as part of the broader AI infrastructure ecosystem, alongside industry collaboration under the “AI Together” theme.

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