Dow Unveils DOW Cooling Science at COMPUTEX TAIPEI 2026 for AI Thermal Management
INSIDE 硬塞 AI1h agoHardwareDow presented its DOW™ Cooling Science platform at COMPUTEX TAIPEI 2026, highlighting high-performance silicone-based solutions. The platform targets thermal management challenges in AI data centers and advanced semiconductors as computing density rises. The announcement positions materials science as part of the broader AI infrastructure ecosystem, alongside industry collaboration under the “AI Together” theme.
Z-COM to Officially Launch NEW Platform at Computex 2026
INSIDE 硬塞 AI3h agoHardwareZ-COM will officially introduce NEW Platform at Computex 2026. The edge-native infrastructure combines network control, AI operations, and energy management in a single architecture. Its stated goal is to support local AI computing and help enterprises reduce dependence on cloud providers and avoid cloud lock-in.
NVIDIA, Arm and Microsoft Tease a New Era of PC Ahead of GTC Taipei
INSIDE 硬塞 AI3d agoHardwareNVIDIA, Arm and Microsoft posted coordinated teasers around “A new era of PC,” tied to mysterious coordinates pointing to Taipei. The report frames the move as a pre-COMPUTEX push, with NVIDIA’s rumored N1X Arm chip expected to appear at GTC Taipei. Still, skepticism remains around delays, high pricing, and backlash against overused AI PC messaging.