Jensen Huang: Vera CPU Is Not Competing in the Same Arena as Intel and AMD
INSIDE 硬塞 AI10h agoHardwareNVIDIA described Vera as the strongest competitor ever to Intel and AMD x86_64 processors in a keynote slide. However, Jensen Huang denied that Vera CPU was intended to take Intel and AMD's market when asked during a global media Q&A. The distinction suggests NVIDIA wants Vera viewed as more than a direct replacement for conventional x86_64 CPUs.
From $2 to $760B: The Two Strategic Bets That Fueled Lisa Su's AMD Turnaround
INSIDE 硬塞 AI8d agoBusinessWhen Lisa Su became AMD's CEO in 2014, the company was near bankruptcy with a $2 stock price. She turned it around through two critical bets: transitioning advanced manufacturing entirely to TSMC, and pioneering the modular "Chiplet" architecture. These strategic moves allowed AMD to leapfrog Intel in performance and efficiency, driving its market cap past $760 billion.
蘇姿丰行程甫告一段落，黃仁勳今再訪台、直奔南港開講★ 70
INSIDE 硬塞 AI10d agoBusiness繼 AMD 董事長暨執行長蘇姿丰的台灣行程告一段落後，NVIDIA 執行長黃仁勳於今日再度抵達台灣。他下飛機後首站便直奔南港，參與 Meet-a-Claw 開發者大會並發表專題演講，再度引發台灣科技界與開發者社群的高度關注。
AI 進入推論時代！蘇姿丰看好 CPU 市場年增 35%，架構很快將變「1:1」★ 75
INSIDE 硬塞 AI11d agoOpinionAMD 執行長蘇姿丰表示，AI 應用正從訓練快速轉向推論階段，帶動 CPU 需求急遽上升。過去半年至一年內少有人提及的 CPU 短缺問題，自去年底起已出現明顯供需轉變。她預期 CPU 市場將迎來年增 35% 的成長，且硬體架構很快將轉變為 CPU 與 GPU 比例趨近「1:1」的新格局。
「當我們要求加快量產，就應該分擔投資」蘇姿丰親解 AMD 百億美元的台灣佈局邏輯★ 75
INSIDE 硬塞 AI11d agoBusinessAMD 執行長蘇姿丰透露在台灣投資百億美元的背後邏輯。她指出，AMD 積極採用 2.5D、3D 及 CoWoS、EFB 等先進封裝技術，當要求合作夥伴加速量產時，AMD 理應共同分擔投資。這筆百億資金不僅是實質支持，更是對台灣頂尖半導體技術投下的巨大信任票。
Hugging Face on AMD Instinct MI300 GPU★ 75
Hugging Face Blog742d agoReleaseHugging Face 宣布與 AMD 展開深度合作，全面優化 AMD Instinct MI300X GPU。透過 AMD ROCm 軟體棧與 Hugging Face 核心庫（如 Transformers、TGI）的無縫整合，開發者無需修改程式碼即可在 MI300X 上運行 Llama 3 等大型模型。MI300X 憑藉 192GB HBM3 超大記憶體，為企業提供極具性價比且能擺脫單一晶片供應商依賴的高效能 AI 算力選擇。